Siemens SIMATIC PANEL PC 877 Instructions d'exploitation Page 55
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- Table des matières
- DEPANNAGE
- MARQUE LIVRES
Noté. / 5. Basé sur avis des utilisateurs
Connecting
5.6 Connecting the equipotential bonding
SIMATIC Panel PC 577
Operating Instructions, Release 04/2006, A5E00798484-01
5-13
Avoiding differences in potential
Differences in potential arise between separated system parts, which in some cases lead to
high equalization currents. This situation may arise if the cable shielding is terminated at
both ends and grounded at different system parts. Potential differences can be caused, for
example, by different power inputs.
Reduce the differences in potential by laying the equipotential bonding cables in such a way
that the affected electronic components function properly. Observe the following guidelines
when setting up equipotential bonding:
• When two system parts are connected by means of a shielded signal cable, and their
shields are both connected to the ground or protective conductor, the following must be
observed: The impedance of the additional equipotential bonding cable amounts to 10%
of the shield impedance, at the most.
• Ensure that the equipotential bonding cable cross-section is selected to accommodate
the maximum equalization current. The equipotential bonding conductor cross-section
that has proven best in practice is 16 mm
2
.
• Use equipotential bonding conductors made of copper or galvanized steel. Connect the
cables to the ground or protective conductor over a wide area. Protect the ground or
protective conductor from corrosion.
• Lay the equipotential bonding cable in such a way that the area between the equipotential
bonding cable and signal cables is as small as possible.
- DOCUMENTATION 1
- SIMATIC 3
- Industrial PC 3
- Preface 5
- Related documentation 6
- Conventions 6
- Trademarks 7
- Additional support 7
- Representatives and offices 7
- Training center 7
- Technical support 8
- Table of contents 10
- Table of contents 11
- 1.1 Safety instructions 13
- System expansions 14
- Battery 14
- ESD guidelines 15
- Electrical connection 16
- High frequency radiation 16
- Overview 17
- Transport 17
- Tools & downloads 18
- Processor and CD-ROM drive 18
- Safety-relevant applications 19
- Sources of light 19
- SIMATIC Panel PC 577 20
- 2.1 Application features 21
- 2.2 Design 22
- 2.3 Technical features 23
- Description 24
- Description 25
- 2.3 Technical features 25
- 3.1 Overview 27
- Approvals 29
- 3.4 EMC directive 31
- Planning use 32
- Planning use 33
- 3.5.3 Mounting type 34
- 3.5.4 Degree of protection 35
- 3.6 Mounting cut-out 36
- 3.6.2 Dimensions 37
- 4.1 Securing with clamps 39
- 4.2 Securing with screws 40
- 4.3 Dimensions 42
- 5.1 Overview 43
- 5.2 Interfaces 45
- 5.2.2 Rear interfaces 46
- Power supply 47
- 5.3 Connecting peripherals 48
- USB interface 49
- Using USB peripherals 49
- Connecting USB devices 50
- Principle 51
- Localized information 51
- For USA and Canada: 52
- 110V power supply 52
- 230V power supply 52
- Active PFC 53
- Connecting 54
- Connecting 55
- Commissioning 59
- 6.2 Overview 61
- 6.3 Switching on the device 63
- Commissioning 69
- Service pack 71
- Automatic updates 71
- 7.1 Normal operation 73
- Switching off the device 75
- 7.2.1 Overview 76
- Function 77
- Special features 78
- USB keyboard controller 78
- 7.2.3 KeyTools 79
- 7.2.4 SystemGuard 80
- 7.2.5 TouchInput 81
- 7.2.6 CheckLanguageID 82
- 8.1 Operator controls 85
- "Soft power" key 86
- 8.2.1 Overview 87
- 8.2.2 Keyboard 88
- Function keys and softkeys 89
- Control keys 89
- Alphanumeric keys 89
- Numeric keys 90
- Cursor keys 90
- External keyboards 91
- 3DUW3DUW3DUW3DUW 92
- 3DUW3DUW 92
- 3DUW 3DUW 3DUW 3DUW 92
- 8.3.1 Overview 93
- 8.3.2 Touch screen 94
- 8.4 DVD-ROM drive 95
- Operating 96
- Integration in TIA 97
- 10.1 Servicing 99
- Chemical resistance 100
- Procedure 100
- Carrying out repairs 101
- Limitation of liability 101
- Servicing and maintenance 102
- 10.2.2 Opening the device 103
- Opening the device 104
- Servicing and maintenance 105
- Closing the device 106
- Memory expansion 108
- Installing the memory module 108
- Removing a memory module 109
- 10.2.5 PCI/WinAC cards 110
- PCI card 111
- WinAC card 112
- 10.2.6 Drives 115
- Introduction 122
- Disposal 124
- Preparation 125
- Reconfiguring the BIOS setup 125
- Requirement 126
- Mounting the device 133
- 10.3 Installing software 136
- Restore DVD: 138
- Backing up authorizations 139
- 10.3 Installing software 141
- 11.1 BIOS error messages 145
- Error diagnosing 146
- 12.1 General problems 147
- Troubleshooting and FAQs 148
- Troubleshooting and FAQs 149
- 12.3 SystemGuard errors 150
- 13.1 Technical data 151
- Technical specifications 152
- Technical specifications 153
- 13.1 Technical data 153
- 13.3 Keyboard table 157
- 13.3 Keyboard table 159
- Detailed descriptions 165
- 14.2 Riser card 166
- 14.3 Touch sensor 167
- 14.4 System resources 169
- 14.4.2 Interrupt assignment 170
- 14.5 BIOS setup 171
- A Appendix 173
- EMC directive 174
- Low Voltage Directive 174
- Declaration of conformity 174
- Installation guidelines 174
- Connecting peripherals 174
- DIN ISO 9001 certificate 175
- Software license agreement 175
- Appendix 176
- A.1.3 ESD guideline 177
- Handling ESD modules 178
- Shipping ESD modules 178
- Appendix 179
- A.2 Abbreviations 180
- A.3 Glossary Definitions CU 181
- SIMATIC Panel PC 577 186
- Index 187
- Index 188
- ,'$( 192
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